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CLH07
TOSHIBA High Efficiency Rectifier Silicon Epitaxial Type
CLH07
Switching Mode Power Supply Applications
Unit: mm
* * * *
Forward voltage: VFM = 1.8 V (Max.) Average forward current: IF (AV) = 5.0 A Repetitive peak reverse voltage: VRRM = 400 V Surface-mount package "L-FLAT" (Toshiba package name)
Absolute Maximum Ratings (Ta = 25C)
Characteristic Repetitive peak reverse voltage Average forward current Peak one cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF(AV) IFSM Tj Tstg Rating 400 5.0 50 (50 Hz) -40~150 -40~150 Unit V A A C C
ANODE CATHODE
JEDEC JEITA

Note 1: T = 92C
Rectangular waveform: ( = 180)
TOSHIBA 3-4F1A Note 2: Using continuously under heavy loads (e.g. the application of Weight: 0.15 g (typ.) high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25C)
Characteristic Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repetitive peak reverse current Reverse recovery time Forward recovery time IRRM trr tfr Test Condition IFM = 1.0 A (pulse test) IFM = 3.0 A (pulse test) IFM = 5.0 A (pulse test) VRRM = 400 V (pulse test) IF = 2A, di/dt = -50 A/s IF = 1.0 A Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode: 5.7 mm x 6.2 mm, Anode :4.5 mm x 3.4 mm Min Typ. 0.98 1.23 1.40 Max 1.80 10 35 100 A ns ns Unit V
Thermal resistance (junction to ambient)
Rth (j-a)
100
C/W
Thermal resistance (junction to ambient)
Rth (j-)
5
C/W
1
2006-11-08
3.20.2
CLH07
Marking
Abbreviation Code H07 Part No. CLH07
Standard Soldering Pad
Unit: mm
5.9
2.5
1.8
2.6
4.8
Handling Precautions
1) The absolute maximum rating denotes the absolute maximum ratings, which are rated values that must not be exceeded during operation, even for an instant. The following are the general derating methods that we recommend for designing a circuit incorporating this device: VRRM: Use this rating with reference to (1) above. The VRRM has a temperature coefficient of 0.1%/C. Take this temperature coefficient into account when designing a device at low temperature. IF (AV): We recommend that the worst case current be no greater than 80% of the absolute maximum rating of IF(AV) and that Tj be below 120C .When using this device, take the margin into consideration by using an allowable Ta (max)-IF (AV) curve. IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value. IFSM: This rating specifies the non-repetitive peak current. This applies to abnormal operation only, When using the device, design the circuit board and the soldering land size to match the appropriate thermal resistance value. Tj: Derate this rating when using the device to ensure high reliability. We recommend that the device be used at a Tj of below 120C. 2) The thermal resistance between junction and ambient varies depending on the mounting condition of the See. When using the device, design the circuit board and the soldering land size to match the appropriate thermal resistance value. 3) See the Rectifiers databook for further information.
2.9
2
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CLH07
iF - vF
100
12
PF (AV) - IF (AV)
iF (A)
Average forward power dissipation PF (AV) (W)
Tj = 150C 10
10 8 6 4 2 0 0 2 4 Average forward current
0 360 = 60
Instantaneous forward current
75C
120
180
1 25C 0.1
Rectangular waveform
Pulse test 0.01 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.0
Conduction angle
Instantaneous forward voltage
vF
(V)
6 IF (AV)
8
(A)
Maximum allowable lead temperature T max (C)
T max - IF (AV)
160 140 120 100 80 60 40 0 360 20 0 0 Conduction angle 2 4 6 8 = 60 Rectangular waveform 120 180 140
Ta max - IF (AV) Maximum allowable ambient temperature Ta max (C)
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness:1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm
120 100 80 60 40 20 0 0 = 60 120 180
Rectangular waveform
0 360 Conduction angle 2 4 6 8
Average forward current
IF (AV)
(A)
Average forward current
IF (AV)
(A)
rth (j-a) - t
1000 500 300
Transient thermal impedance rth (j-a) (C/W)
100 50 30 10 5 3 1 0.5 0.3 0.1 0.001
Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness:1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm 0.003 0.01 0.03 0.1 0.3 1 3 10 30 100 300 1000
Time
t
(s)
3
2006-11-08
CLH07
Surge forward current Cj - V R
1000
(Typ.)
60
(non-repetitive)
IFSM (A)
Ta = 25C
Ta = 25C 50 f = 50 Hz
Cj
(pF)
f = 1 MHz
100
40
Peak surge forward current
3 5 10 30 50 100
Junction capacitance
30
10
20
10
1 1
Reverse voltage
VR (V)
0 1
3
5
10
30
50
100
Number of cycles
4
2006-11-08
CLH07
RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
5
2006-11-08

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